New Developments in Passive Electronic Component Technology: 2007-2008

Introduction:

During the 2007 calendar year the investment in passive component technology (capacitors, resistors, and inductors) had some common themes. The general trend is to manufacture components with enhanced performance in smaller packages. In 2007 this was not limited to surface mount designs only, but included greater investments in expanding technology in axial and radial leaded designs as well. The greatest advancements continue to be in higher capacitance ceramic chip capacitors and in conductive polymer aluminum and tantalum electrolytic capacitors. Increasingly smaller part designs in AC film capacitors, DC film capacitors, chip resistors and chip inductors are also noted. Extensions of existing technology in high voltage axial and radial leaded passive components in the west are also noted to satisfy demand from the automotive and defense sectors.

Ceramics:

Developments in Ceramic Capacitors

The continuing strategic theme in ceramic capacitors has been the investment in higher capacitance designs in X5R, X7R and Y5V dielectrics. Manufacturers of ceramic capacitors typically spend a higher percentage of overall revenues on research and development when compared to manufacturers of other dielectrics, and this continues to pay dividends by helping manufacturers expand their ceramic chip capacitor offerings into alternative dielectrics (tantalum and aluminum). The following table illustrates changes in ceramic capacitor technology in calendar year 2007 by major manufacturer and illustrates synergies between vendors through color coding of the chart. While the major developments have been the movement to higher capacitance chips, the expansion of specialty axial and radial leaded ceramic capacitor lines is noted among multiple manufacturers in the west. According to primary sources, customers in the automotive sector and defense sector have suggested they will continue to support production of axial and radial leaded designs as long as the manufacturers of these parts extend the technology into higher voltage and higher capacitance product offerings. In MLCC we see additional trends that point toward the continued development of ultra-small case sizes (primarily the 01005 case), and the continued development of higher voltage म्ल्क्क

Electrolytics:

Technology Developments in Aluminum, Tantalum, and Niobium Capacitors by Manufacturer: CY 2007

In electrolytic capacitors, which include aluminum electrolytic, tantalum electrolytic and niobium type capacitors, the primary strategic investment theme continues to be investments in conductive polymer cathodes that are designed to lower the equivalent series resistance in the finished capacitor design. The tactical developments in electrolytic capacitors mirrored that of ceramic capacitors in CY 2007, with emphasis on the development of higher voltage and higher capacitance radial leaded designs for the automotive and defense सेक्टर्स Spending on research and development for electrolytic capacitors is smaller than that of ceramic capacitors due to the higher revenue base for ceramic chips compared to that of electrolytic designs. Ceramic capacitor manufacturers typically have a larger revenue base and greater profitability when compared to electrolytic capacitor manufacturers, which frees up more dollars for research and development as a percentage of overall sales.

Paper and Plastic Capacitors:

Technology Developments in Paper and Plastic Capacitors by Manufacturer: CY 2007 (Metallized OPP and PET Film Capacitors)

The major technology initiative in paper and plastic capacitors has been the continued development of the DC link capacitor for hybrid electric vehicles using polypropylene dielectric films. In the metallized polyester film capacitor markets, the trend is towards miniaturization as well as the continued development of polypropylene based film dielectric capacitors in surface mount formats

Resistors:

Technology Developments in Discrete Resistors by Manufacturer: 2007 CY

In resistors, the high ruthenium price has lead many to look for an alternative thick or thin film metal solution based upon nickel or another base metal. Otherwise the continued trend is toward thin film integrated passive components and multi-chip resistor arrays. The technology developments in resistors are toward smaller case sizes, precision - including thin film chips, array development and then higher power handling and higher voltage handling capabilities of specific types of axial and radial resistor designs. Developments in axial and radial resistors, including higher voltages and greater precision, mirror developments in ceramic and tantalum capacitors, and these developments are being instigated by demand from the automotive and defense sectors

Inductors:

Technology Developments in Discrete Inductors by Manufacturer: 2007 CY

In 2007 FY there were some major developments in ultra-small chip size inductors, as well as some fascinating developments in the accuracy of wire winding on inductor cores. The technology advancements in discrete inductors are similar to developments in capacitors and resistors insomuch as the manufacturers are working to develop increasingly smaller case size parts in both multilayered and wirewound designs, with greater performance. In chip inductors, this is accomplished through the application of nano-technology to the ferrite materials used in their production, and in wirewound coils, smaller case sizes are accomplished using more accurate wire winding techniques and more compact पच्कगेस

Summary and Conclusions:

In 2007 we noted continuing developments in strategic initiatives, with emphasis upon higher capacitance ceramics, conductive polymer electrolytics, and case size miniaturization (apparent across multiple component types in capacitors, resistors and inductors)। The tactical developments in 2007 primarily centered upon the extension of voltage handling capabilities and greater product performance in the axial and radial leaded parts in ceramic capacitors, tantalum capacitors and in discrete resistors. In inductors, precision winding techniques have enabled higher performance in increasingly smaller case sizes.